Method for inspecting and repairing the defects of the photoresist, as well as printed circuit board manufacturing process

摘要

PROBLEM TO BE SOLVED: To provide a method of inspecting defects in photoresist and mending the photoresist to its original state.;SOLUTION: A substrate is provided with at least one film on its surface. A patterned photoresist layer is formed on the film. Then, optical inspection processing is carried out to check whether the patterned photoresist layer has defects. When the patterned resist layer has defects, the defects are classified into two groups, gaps and projections, and then the gaps and projections are positioned. If the patterned photoresist layer has defects, such as gaps etc, the patterned photoresist layer is subjected to for instance an ink jet printing method for filling up the gaps. If the patterned photoresist layer has defects, such as projections etc, the patterned photoresist layer undergoes for instance a laser method for removing the projections. Thus, defects in the patterned photoresist layer are removed, and the photoresist layer is mended to its original condition.;COPYRIGHT: (C)2007,JPO&INPIT