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A method for manufacturing a GaN-based nitride semiconductor free-standing substrate

机译:一种GaN基氮化物半导体自支撑衬底的制造方法

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a stress-free GaN-based nitride compound semiconductor at a low cost by a simple process.;SOLUTION: A method for manufacturing a GaN-based nitride semiconductor self-supporting substrate includes: a step of preparing a substrate; a step of forming a GaN dot and an NH4Cl layer on the substrate; a step of forming a low-temperature GaN buffer layer on the GaN dot and the NH4Cl layer; a step of forming a GaN nitride semiconductor layer on the low-temperature GaN buffer layer; and a step of naturally removing the GaN-based nitride semiconductor layer from the substrate by returning the substrate temperature to a normal temperature.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种通过简单的工艺低成本制造无应力的GaN基氮化物化合物半导体的方法。解决方案:一种制造GaN基氮化物半导体自支撑衬底的方法包括:制备基板的步骤;在衬底上形成GaN点和NH 4 Cl层的步骤;在GaN点和NH 4 Cl层上形成低温GaN缓冲层的步骤;在低温GaN缓冲层上形成GaN氮化物半导体层的步骤;通过将衬底温度恢复到常温自然地从衬底上去除GaN基氮化物半导体层的步骤。版权所有:(C)2009,JPO&INPIT

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