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In the semiconductor equipment which possesses OTP ROM which is formed to the semiconductor equipment which possesses ROM whose programming

机译:在具有OTP ROM的半导体设备中,该半导体设备形成为具有对其编程的ROM的半导体设备

摘要

A semiconductor device with a one-time programmable (OTP) ROM disposed over a semiconductor substrate including a memory cell area and a peripheral circuit area includes a MOS transistor and an OTP ROM capacitor. The MOS transistor has a floating gate electrode and is disposed at the memory cell area. The OTP ROM capacitor has a lower electrode, an upper intermetal dielectric, and an upper electrode which are stacked in the order named. The OTP ROM capacitor is disposed on the MOS transistor, and the floating gate electrode and the lower electrode are connected by a floating gate plug to constitute an electrically insulated conductive structure. The upper intermetal dielectric is made of at least one selected from the group consisting of silicon oxide, silicon nitride, and silicon oxynitride and may be disposed on an entire surface of the semiconductor substrate. A capacitor formed together with the OTP ROM is disposed at the peripheral circuit region.
机译:具有设置在包括存储单元区域和外围电路区域的半导体衬底上的一次性可编程(OTP)ROM的半导体器件包括MOS晶体管和OTP ROM电容器。 MOS晶体管具有浮置栅电极,并设置在存储单元区域。 OTP ROM电容器具有以指定顺序堆叠的下电极,上金属间电介质和上电极。 OTP ROM电容器设置在MOS晶体管上,并且浮栅电极和下电极通过浮栅插塞连接以构成电绝缘的导电结构。上金属间电介质由选自由氧化硅,氮化硅和氮氧化硅组成的组中的至少一种制成,并且可以设置在半导体基板的整个表面上。与OTP ROM一起形成的电容器设置在外围电路区域。

著录项

  • 公开/公告号JP4642344B2

    专利类型

  • 公开/公告日2011-03-02

    原文格式PDF

  • 申请/专利权人 三星電子株式会社;

    申请/专利号JP20030405966

  • 发明设计人 金 明 壽;

    申请日2003-12-04

  • 分类号H01L27/10;H01L21/3205;H01L23/52;H01L27/115;H01L21/8247;H01L29/792;H01L29/788;

  • 国家 JP

  • 入库时间 2022-08-21 18:17:56

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