Flexible printed wiring board using the same polyimide precursor, photosensitive polyimide precursor composition, and photosensitive dry film

摘要

And non-tacky to the photosensitive dry film, there is no cracking of the photosensitive layer can be bent a photosensitive dry film on solvent removal after lithography is good, when used in the FPC, the warpage of the FPC bake after less, to provide a flexible printed wiring board using the same polyimide precursor which expresses flame retardancy without incorporating halogen compounds, photosensitive polyimide precursor composition, and a photosensitive dry film. Polyimide precursors of the present invention is characterized in that it comprises an acid dianhydride represented by the following general formula (1). [Formula 1] (X represents a halogen group, monovalent alkyl group of 1 to 10, or an alkoxy group, a hydrogen atom, carbon atoms are .R ₁ is a divalent organic group having carbon atoms of an alkylene group having from 3 to 30 .)