Being the bonding tool which is installed in the bonding device which is made to adhere

摘要

PROBLEM TO BE SOLVED: To provide ultrasonic flip-chip bonding equipment capable of stably operating.;SOLUTION: A bonding tool having a cross sectional area of 3.7 mm² that consists of a tool main body part 4a composed of a square cylindrical body made of hard metal of approximately 8 mm long and an installation part 4b of approximately 10 mm long which is extended/connected to one end of this tool main body part are used and an oscillation frequency in an ultrasonic oscillation system is set at 60 kHz, and thus flip chip bonding is performed. Now, the overall length of the ultrasonic oscillation is 70 mm.;COPYRIGHT: (C)2002,JPO