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Copper solution null for photochemical circuit formation manner and photochemical circuit formation

机译:用于光化学回路形成方式和光化学回路形成的铜溶液为零

摘要

PROBLEM TO BE SOLVED: To directly form a wiring circuit on a substrate by continuously reductively depositing a metal (copper, etc.) by the irradiation with active energy rays.;SOLUTION: A method for forming a photochemical circuit with a reduction assistant that is carboxylic acid comprises: a step (a) of modifying an insulating substrate; a step (b) of depositing a mixed solution of metal ions with a reduction assistant on the insulating substrate; and a step (c) of forming a fine pattern of a metal by reductively depositing the metal ions onto the metal by the action of the reduction assistant accompanied with the irradiation with active energy rays. The carboxylic acid is decomposed by the irradiation with the active energy rays, and the metal ions are reduced by electrons emitted in that case to form a metal wiring circuit. Thus, there is no need for using a TiO2 photocatalyst as conventionally.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:通过用活性能量射线照射连续还原性地沉积金属(铜等)来在基板上直接形成布线电路。解决方案:一种具有还原助剂的光化学电路形成方法是:羧酸包括:改性绝缘基材的步骤(a);步骤(b),在绝缘基板上沉积金属离子与还原助剂的混合溶液;步骤(c),通过还原助剂的作用,伴随着活性能量射线的照射,将金属离子还原性地沉积在金属上,从而形成金属的精细图案。羧酸通过用活性能量射线照射而分解,并且在这种情况下通过发射的电子将金属离子还原,从而形成金属布线电路。因此,不需要像以往那样使用TiO 2 光催化剂。版权所有:(C)2007,日本特许厅&INPIT

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