Production manner of the integrated circuit, accumulation of the copper seed after doing, the injection manner which is done, the manner which forms the beer in formation manner, and the integrated circuit of barrier/seed surface formation.

摘要

Formation method of the integrated circuit, in the vicinity of thing and the barrier layer which form barrier layer alongside the side side wall and the base of the beer open part, has with the fact that at the same time fill layer is formed conformal in barrier layer and seed layer for the vicinity of thing and barrier layer and the seed layer which at the same time form seed layer conformal in barrier layer. The beer open part has the constitution which receives the beer material which connects with 1st conductive layer and 2nd conductive layer electrically.