Method for manufacturing a semiconductor device wherein the electrical connection between two components is provided by capillary phenomenon of a liquid conductor material in a cavity therebetween

摘要

A method for manufacturing a semiconductor device includes: (a) transferring an electronic component that has an electrode and formed on a first substrate from the first substrate to a second substrate; and (b) forming a wiring line electrically coupling the electrode and a terminal on the second substrate. A cavity is provided between the electrode of the electronic component transferred on the second substrate and the second substrate, and the wiring line is formed in the cavity.