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Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement
Integrated circuit chip module with microchannel cooling device having specific fluid channel arrangement
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机译:具有具有特定流体通道布置的微通道冷却装置的集成电路芯片模块
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摘要
Apparatus and methods are provided for integrating microchannel cooling modules within high-density electronic modules (e.g., chip packages, system-on-a-package modules, etc.,) comprising multiple high-performance IC chips. Electronic modules are designed such that high-performance (high power) IC chips are disposed in close proximity to the integrated cooling module (or cooling plate) for effective heat extraction. Moreover, electronic modules which comprise large surface area silicon carriers with multiple chips face mounted thereon are designed such that integrated silicon cooling modules are rigidly bonded to the back surfaces of such chips to increase the structural integrity of the silicon carriers.
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