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Cooling an integrated circuit chip with cooling fluid in a microchannel and a thermoelectric thin film cooling device in the microchannel
Cooling an integrated circuit chip with cooling fluid in a microchannel and a thermoelectric thin film cooling device in the microchannel
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机译:用微通道中的冷却液和微通道中的热电薄膜冷却装置冷却集成电路芯片
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摘要
A method includes an integrated circuit (IC) die that has a front surface on which an integrated circuit is formed. The IC die also has a rear surface that is opposite to the front surface. The method also includes a microchannel member to define at least one microchannel at the rear surface of the IC die. The microchannel is to allow a coolant to flow through the microchannel. The method further includes at least one thin film thermoelectric cooling (TFTEC) device in the at least one microchannel.
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