首页>
外国专利>
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
展开▼
机译:限球冶金法,与其一起使用的焊料凸点组合物,由此组装的包装及其组装方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A ball-limiting metallurgy (BLM) stack is provided for an electrical device. The BLM stack resists tin migration toward the metallization of the device. A solder system is also provided that includes a eutectic-Pb solder on a substrate that is mated to a high-Pb solder, and that withstands higher temperature reflows and other higher temperature processes.
展开▼