Power plane and land pad feature to prevent human metal electrostatic discharge damage

摘要

An IC package includes an IC die mounted on a substrate that includes an ESD protection structure formed within the substrate to dissipate any charge accumulation associated with the package's no-connect pins resulting from human body model ESD and/or voltage spikes during package testing. For some embodiments, the ESD protection structure includes a resistive element formed in the substrate between the no-connect pin and a power plane. For other embodiments, the ESD protection structure includes a conductive ring formed in the substrate and laterally surrounding the land pad of the no-connect pin.