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High-temperature solder, high-temperature solder paste and power semiconductor using same
High-temperature solder, high-temperature solder paste and power semiconductor using same
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机译:高温焊锡,高温焊锡膏以及使用其的功率半导体
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摘要
The present invention intends to provide a power semiconductor device using a high-temperature lead-free solder material, the high-temperature lead-free solder material having the heat resistant property at 280° C. or more, and the bondability at 400° C. or less, and excellent in the suppliabilty and wettability of solder, and in the high-temperature storage reliability and the temperature cycle reliability. In the power semiconductor device according to the present invention, a semiconductor element and a metal electrode member were bonded each other by a high-temperature solder material comprising Sn, Sb, Ag, and Cu as the main constitutive elements and the rest of other unavoidable impurity elements wherein the high-temperature solder material comprises 42 wt %≦Sb/(Sn+Sb)≦48 wt %, 5 wt %≦Ag20 wt %, 3 wt %≦Cu10 wt %, and Ag+Cu≦25 wt %.
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