An X-ray inspection apparatus (100) previously acquires and stores a mask thickness in a cream solder printing as a thickness of the solder applied on the board. In a cross-section parallel to a board surface, a range in a height direction is set as an inspection target from the mask thickness of the inspection target board, and the number of cross-sections (N) is specified (S801). The X-ray inspection apparatus (100) measures an area (S) and roundness (T) of the solder in an inspection window for each cross-section (S807 to S819). When the minimum values of the area (S) and roundness (T) are not lower than reference values, the X-ray inspection apparatus (100) determines that the soldering of the inspection window is nondefective (S821 and S823). When one of the minimum values of the area (S) and roundness (T) is lower than the reference value, the X-ray inspection apparatus (100) determines that the soldering of the inspection window is defective (S821 and S823).
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