首页> 外国专利> MANUFACTURING METHOD OF A METAL OXIDE LAYER, CAPABLE OF REDUCING THE SURFACE ROUGHNESS OF A METAL OXIDE LAYER, A THIN FILM TRANSISTOR SUBSTRATE THEREOF, AND A MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF A METAL OXIDE LAYER, CAPABLE OF REDUCING THE SURFACE ROUGHNESS OF A METAL OXIDE LAYER, A THIN FILM TRANSISTOR SUBSTRATE THEREOF, AND A MANUFACTURING METHOD THEREOF

机译:金属氧化物层的制造方法,能够降低金属氧化物层的表面粗糙度的薄膜晶体管基体材料及其制造方法

摘要

PURPOSE: A manufacturing method of a metal oxide layer, a thin film transistor substrate thereof, and a manufacturing method thereof are provided to improve the surface roughness, charge mobility, and crystallization of a metal oxide layer by controlling chamber pressure.;CONSTITUTION: A first metal oxide layer(11) is formed on a substrate(10). The first metal oxide layer has first charge mobility. A second metal oxide layer(12) is formed to be directly contacted on the first metal oxide layer. The second metal oxide layer has second charge mobility which is different from the first charge mobility.;COPYRIGHT KIPO 2011
机译:目的:提供一种金属氧化物层的制造方法,其薄膜晶体管基板及其制造方法,以通过控制腔室压力来改善金属氧化物层的表面粗糙度,电荷迁移率和结晶度。在衬底(10)上形成第一金属氧化物层(11)。第一金属氧化物层具有第一电荷迁移率。第二金属氧化物层(12)形成为直接接触第一金属氧化物层。第二金属氧化物层具有与第一电荷迁移率不同的第二电荷迁移率。; COPYRIGHT KIPO 2011

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