MULTI-LAYER PRINTED CIRCUIT BOARD WITH BUILT-IN CHIP AND A FABRICATING METHOD THEREOF, CAPABLE OF EASILY MANUFACTURING THE MULTI-LAYER PCB

摘要

PURPOSE: A multi-layer printed circuit board with built-in chip and a fabricating method thereof are provided to improve the productivity and reduce the manufacturing cost by easily laminating the printed circuit board mounted with different IC chips after manufacturing the multi-layer printed circuit board.;CONSTITUTION: The package face of an IC chip(120) is welded on the upper part of a laminate carrier substrate(100) consisting of insulator. A chip-mounted substrate formed with a stud bump(130) on the wire bonding area of the IC chip is manufactured. An insulating substrate(200) including the penetration hole corresponding to the stud bump is manufactured on a resin substrate.;COPYRIGHT KIPO 2011