BUMP FORMING DEVICE AND A BUMP FORMING METHOD USING THE SAME, CAPABLE OF FORMING A BUMP WITH UNIFORM SIZE ON AN ELECTRODE PAD

摘要

PURPOSE: A bump forming device and a bump forming method using the same are provided to reduce manufacturing costs by directly coating paste on an object.;CONSTITUTION: A main body(210) has an internal space filled with conductive paste for forming a bump. The main body has a lower surface in contact with the object. A paste nozzle unit(220) is comprised of a penetration hole connected to the inner space. A hydraulic cylinder(290) is mounted on the upper side of the main body. The hydraulic cylinder applies hydraulic pressure to the inner space to extract conductive paste for forming the bump through the paste nozzle.;COPYRIGHT KIPO 2011