CORE SOLDER BALL USED FOR FORMING A BUMP OF THE SURFACE MOUNTED DEVICE, A CORE SOLDER BALL MANUFACTURING METHOD, AND AN ELECTRONIC COMPONENT INCLUDING THE SAME

摘要

PURPOSE: A core solder ball, a core solder ball manufacturing method, and an electronic component including the same are provided to restrain the generation of the metallic compound on the bonding boundary between a metal layer and a solder layer by forming the solder layer after forming dual metal layers.;CONSTITUTION: A first metal layer(22) is formed on the surface of the metal or the plastic core(21). A second metal layer(23) including the metal of a kind different from the first metal layer is formed on the first metal layer. A first solder layer containing Sn-Cu or Sn-Ag is formed on the second metal layer. The second solder layer made of alloy different from the first solder layer is formed on the first solder layer.;COPYRIGHT KIPO 2011