DIE BONDER FOR ATTACHING DEVICES TO A LEAD FRAME FOR A PACKAGING PROCESS AND A TRANSFERRING TOOL FOR THE DIE BONDER

摘要

PURPOSE: A die bonder and a transferring tool for the die bonder are provided to pick up and transfer devices loaded on a wafer by alternatively using a pair of pickers, thereby drastically increasing processing speed of a device by quickly transferring the device.;CONSTITUTION: A lead frame(3) with a plurality of loading units(2) is loaded on a loading unit(100). The lead frame is unloaded from the unloading unit(200). A guide unit(300) guides movement of the lead frame from the loading unit to the unloading unit. A transfer tool(400) picks up devices from a wafer(10) and loads the devices on the loading unit. The devices are loaded on the wafer and transferred after the devices are cut.;COPYRIGHT KIPO 2011