COMPOSITION FOR AN UNDERFILL MATERIAL WITH NO ADVERSE EFFECT ON THE WARPAGE BEHAVIOR IN A REFLOW PROCESS AND AN OPTICAL SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE: A composition for an underfill material is provided to produce a cured product with improved moldability, adhesiveness to a gold bump, heat-resistance, and light resistance.;CONSTITUTION: An composition for an underfill material comprises (A) 60 to 99 parts by weight of a branched organopolysiloxane having a weight average molecular weight of from 500 to 20000, reduced to polystyrene, and represented by chemical formula (1): (CH3)aSi(OR1)b(OH)cO_(4-a-b-c)/2, wherein R1 is an organic group having 1 to 4 carbon atoms and a, b, and c are numbers satisfying the equations: 0.8=a=1.5, 0=b=0.3, 0.001=c=0.5, and 0.801=a + b + c2, (B) 250 to 1000 parts by weight of an inorganic filler, (C) 0.01 to 10 parts by weight of a condensation catalyst, (D) 1 to 40 parts by weight of an organopolysiloxane having a linear diorganopolysiloxane moiety represented by the following formula (2), wherein R2 and R3 are, independently of each other, selected from the group consisting of a hydroxyl group, alkyl groups having 1 to 3 carbon atoms, a cyclohexyl group, a vinyl group, a phenyl group and an allyl group, and m is an integer of from 5 to 50, provided that the total amount of component (A) and component (D) is 100 parts by weight, and (E) 0.2 to 2.0 parts by weight of a silane coupling agent.;COPYRIGHT KIPO 2011