首页> 外国专利> THERMOSETTING COMPOSITION FOR OPTICAL SEMICONDUCTOR, DIE BOND MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, UNDERFILL MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, SEALING AGENT FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE

THERMOSETTING COMPOSITION FOR OPTICAL SEMICONDUCTOR, DIE BOND MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, UNDERFILL MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, SEALING AGENT FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE

机译:光学半导体用热熔组合物,光学半导体装置用的芯片结合材料,光学半导体装置用的填充材料,光学半导体装置的密封剂以及光学半导体装置

摘要

To provide a thermosetting composition for an optical semiconductor which is highly transparent, is free-from decrease in thickness or discoloration of a cured product due to heat generation or light emitting of a light emitting device, is superior in heat resistance and lightfastness, and has excellent adhesion to a housing material or the like, a sealing agent for an optical semiconductor device and a die bond material for an optical semiconductor device using the same, and an optical semiconductor device obtained by using the thermosetting composition for an optical semiconductor, the sealing agent for an optical semiconductor, the die bond material for an optical semiconductor device and/or the underfill material for an optical semiconductor device.;A thermosetting composition for an optical semiconductor containing a silicone resin having a cyclic ether-containing groups and a thermosetting agent capable of reacting with said cyclic ether-containing group, wherein the silicone resin has, as the principal components, a structural unit expressed by the following formula (1) and a structural unit expressed by the following formula (2), the content of the structural unit expressed by the formula (1) is 0.6 to 0.95 (on a molar basis) and the content of the structural unit expressed by the formula (2) is 0.05 to 0.4 (on a molar basis) when total number of the structural units contained is taken as 1, and the content of the cyclic ether-containing group is 5 to 40 mol%:        [formula 1] (R1R2SiO2/2)     (1)and        [formula 2] (R3SiO3/2)     (2)in the formula (1) and (2), at least one of R1, R2 and R3 represents a cyclic ether-containing group, R1, R2 and R3 other than the cyclic ether-containing group represent hydrocarbon having 1 to 8 carbon atoms or fluoride thereof and they may be the same or may be different from one another and plural types of R1, R2 and R3 different from each other in a repeating unit in a silicone resin skeleton may be contained.
机译:为了提供用于光学半导体的热固性组合物,该热固性组合物是高度透明的,不会由于发光器件的发热或发光而导致厚度减小或固化产物的变色,并且具有优异的耐热性和耐光性,并且具有与壳体材料等的密合性优异,用于光半导体装置的密封剂和使用该密封剂的光半导体装置的芯片接合材料,以及通过将光固化性组合物用于光半导体而得到的光半导体装置,用于光半导体的试剂,用于光半导体器件的芯片接合材料和/或用于光半导体器件的底部填充材料。用于光半导体的热固性组合物,其包含具有含环醚基团的硅树脂和热固剂。能够与所述含环状醚的基团反应,其中硅氧烷作为具有以下式(1)表示的结构单元和由以下式(2)表示的结构单元作为主要成分,式(1)表示的结构单元的含量为0.6〜0.95(当所包含的结构单元的总数为1时,由式(2)表示的结构单元的含量为0.05至0.4(以摩尔为基础),并且环醚的含量为-含5至40mol%的基团:[式1](R 1 R 2 SiO 2/2 )(1)和[式2](R 3 SiO 3/2 )(2)在式(1)和(2)中,R 1 ,R 2 和R 3 中的至少一个表示含环醚含环醚基团以外的基团R 1 ,R 2 和R 3 表示具有1至8个碳原子的烃或其氟化物它们可以相同或彼此不同,并且多种类型的R 1 ,R 2 和R 3 彼此不同重复单元中的硅酮树脂骨架可以包含在硅酮树脂骨架中。

著录项

  • 公开/公告号EP2017295A1

    专利类型

  • 公开/公告日2009-01-21

    原文格式PDF

  • 申请/专利权人 SEKISUI CHEMICAL CO. LTD.;

    申请/专利号EP20070742383

  • 申请日2007-04-25

  • 分类号C08G59/32;C08G77/14;C08L83/06;H01L21/52;H01L23/29;H01L23/31;H01L33;

  • 国家 EP

  • 入库时间 2022-08-21 19:16:38

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号