THERMOSETTING COMPOSITION FOR OPTICAL SEMICONDUCTOR, DIE BOND MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, UNDERFILL MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, SEALING AGENT FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE

摘要

Disclosed is a thermosetting composition for optical semiconductors which is high in transparency and excellent in heat resistance, light resistance and adhesion to housing materials and the like, while being free from film thinning or discoloration due to heat generation or light emission of a light-emitting device. Also disclosed are a sealing agent for optical semiconductor devices and a die bond material for optical semiconductor devices each using such a thermosetting composition, and an optical semiconductor device obtained by using the thermosetting composition for optical semiconductors, the sealing agent for optical semiconductor devices, the die bond material for optical semiconductor devices and/or an underfill material for optical semiconductor devices. Specifically disclosed is a thermosetting composition for optical semiconductors, which contains a silicone resin having a cyclic ether-containing group, and a heat curing agent reactive with the cyclic ether-containing group. The silicone resin mainly contains a structural unit represented by the general formula (1) below and a structural unit represented by the general formula (2) below. When the total number of the structural units contained in the silicone resin is taken as 1, the content of the structural unit represented by the general formula (1) is 0.6-0.95 (on a molar basis) and the content of the structural unit represented by the general formula (2) is 0.05-0.4 (on a molar basis). In addition, the thermosetting composition for optical semiconductors contains 5-40% by mole of the cyclic ether-containing group. [chemical formula 1] (R1R2SiO2/2) (1) [chemical formula 2] (R3SiO3/2) (2)