首页>
外国专利>
SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING CAPABLE OF IMPROVING PROCESS RELIABILITY AND PRODUCTIVITY AND A METHOD FOR PREPARING THE SAME
SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING CAPABLE OF IMPROVING PROCESS RELIABILITY AND PRODUCTIVITY AND A METHOD FOR PREPARING THE SAME
展开▼
机译:具有改善工艺可靠性和生产率的化学机械抛光的浆料组合物及其制备方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
PURPOSE: A slurry composition for chemical mechanical polishing is provided to ensure high polishing rate for a silicon oxide film and to enable the application to a shallow trench isolation process for removing an initial step of a silicon oxide film. ;CONSTITUTION: A slurry composition for chemical mechanical polishing comprises: abrasive particles including cerium oxide particles; one or more additives selected from the group consisting of picolinic acids, propionic acids, and formic acids; and aqueous solution including water. The zeta potential of the abrasive particle surface is 20-70 mV within a range of pH 3-6.;COPYRIGHT KIPO 2011
展开▼