首页> 外国专利> TRANSISTOR, A METHOD FOR MANUFACTURING THE SAME, AND AN ELECTRONIC DEVICE INCLUDING THE TRANSISTOR CAPABLE OF SUPPRESSING THE CHANGE OF CHARACTERISTICS DUE TO EXTERNAL ENVIRONMENT

TRANSISTOR, A METHOD FOR MANUFACTURING THE SAME, AND AN ELECTRONIC DEVICE INCLUDING THE TRANSISTOR CAPABLE OF SUPPRESSING THE CHANGE OF CHARACTERISTICS DUE TO EXTERNAL ENVIRONMENT

机译:晶体管,一种制造晶体管的方法,以及一种电子设备,该电子设备包括能够抑制由于外部环境而引起的特性变化的晶体管

摘要

PURPOSE: A transistor, a method for manufacturing the same, and an electronic device including the transistor are provided to improve the reliability of a flat display apparatus by being adapted to the flat display apparatus. ;CONSTITUTION: A multi-layered structure includes a silicon oxide layer(10), a silicon oxynitride layer(20), and a silicon nitride layer(30). The silicon oxide layer is capable of being formed at low temperature between 100 and 250 degrees Celsius or at high temperature between 250 and 450 degrees Celsius. The characteristic change of a channel layer(C1) is suppressed by a protective layer(P1). The thicknesses of a gate(G1), the channel layer, a gate insulating layer, a source electrode(S1), a drain electrode(D1), and a protective layer are respectively between 50 and 300nm, between 40 and 100nm, between 50 and 400nm, between 10 and 200nm, between 10 and 200nm, and between 250 and 1200nm.;COPYRIGHT KIPO 2011
机译:目的:提供一种晶体管,用于制造该晶体管的方法以及包括该晶体管的电子设备,以通过适合于该平面显示设备来提高平面显示设备的可靠性。组成:一种多层结构,包括氧化硅层(10),氮氧化硅层(20)和氮化硅层(30)。氧化硅层能够在100至250摄氏度之间的低温下或在250至450摄氏度之间的高温下形成。沟道层(C1)的特性变化被保护层(P1)抑制。栅极(G1),沟道层,栅极绝缘层,源极(S1),漏极(D1)和保护层的厚度分别在50和300nm之间,在40和100nm之间,在50之间和400nm,10和200nm之间,10和200nm之间以及250和1200nm之间; COPYRIGHT KIPO 2011

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