首页> 外国专利> NON-FLOW RESIN COMPOSITION FOR UNDERFILL CAPABLE OF CONTROLLING THE CONTROL OF THICKNESS AND AREA, A NON-FLOW UNDERFILL FIM USING THE SAME AND A MANUFACTURING METHOD THEREOF

NON-FLOW RESIN COMPOSITION FOR UNDERFILL CAPABLE OF CONTROLLING THE CONTROL OF THICKNESS AND AREA, A NON-FLOW UNDERFILL FIM USING THE SAME AND A MANUFACTURING METHOD THEREOF

机译:能够控制厚度和面积控制的底料的非流动性树脂组合物,使用相同的非流动性底料及其制造方法

摘要

PURPOSE: A non-flow resin composition for underfill is provided to ensure viscosity of 500cps or more suitable for film coating and to accurately control the coating thickness and coating area of the underfill. ;CONSTITUTION: A non-flow resin composition for underfill comprises a thermoplastic epoxy prepolymer, a high temperature hardener, a thermoplastic resin for reforming and a melting material. A method for preparing a non-flow underfill film comprises the steps of: reacting an epoxy resin with a low temperature hardener at 80°C to obtain a themoplastic epoxy prepolymer; mixing the obtained themoplastic epoxy prepolymer, high temperature hardener, thermoplastic resin for reforming and melting material to blend a non-flow resin composition for underfill; and applying the non-flow resin composition for underfill to a base film.;COPYRIGHT KIPO 2011
机译:目的:提供用于底部填充剂的非流动性树脂组合物,以确保粘度为500cps或更高,适用于薄膜包衣,并精确控制底部填充剂的涂层厚度和涂覆面积。组成:用于底部填充的非流动性树脂组合物,包括热塑性环氧预聚物,高温硬化剂,用于重整的热塑性树脂和熔融材料。一种制备非流动性底部填充膜的方法,包括以下步骤:使环氧树脂与低温硬化剂在80℃下反应以获得热塑性环氧预聚物;将获得的热塑性环氧预聚物,高温硬化剂,用于重整和熔融材料的热塑性树脂混合,以掺混用于底部填充的非流动性树脂组合物;并将底部填充用非流动性树脂组合物施涂到基膜上。; COPYRIGHT KIPO 2011

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