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SEMICONDUCTOR DIODES FABRICATED BY ASPECT RATIO TRAPPING WITH COALESCED FILMS

机译:半导体薄膜通过比例成膜比例成比例的陷印来制造

摘要

PURPOSE: Semiconductor diodes fabricated by an aspect ratio trapping with coalesced films are provided to remove a silicon wafer substrate from a semiconductor to prevent the deterioration of the performance of a light emitting diode. CONSTITUTION: In semiconductor diodes fabricated by an aspect ratio trapping with coalesced films, a dielectric material comprises at least two opening exposing a part of a substrate having at least aspect ratio over l. A lower diode material(1030) is lattice-mismatched with the substrate, occupies more than two openings and a compound semiconductor material which forms a lower diode region by being merged on more than two opening. An active diode region is arranged between the upper diode material(1070) and the lower diode material.
机译:目的:提供通过用聚结膜捕获长宽比而制造的半导体二极管,以从半导体中去除硅晶片基板,以防止发光二极管的性能下降。组成:在通过聚结膜捕获长宽比制造的半导体二极管中,介电材料包括至少两个开口,露出至少一部分长宽比超过1的衬底部分。下二极管材料(1030)与衬底晶格失配,占据两个以上的开口,并且化合物半导体材料通过在两个以上的开口上合并而形成下二极管区域。有源二极管区域布置在上二极管材料(1070)和下二极管材料之间。

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