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WAFER CLEANING DEVICE CAPABLE OF SIMULTANEOUSLY ELIMINATING ORGANIC CONTAMINANTS AND METAL CONTAMINANTS AND A METHOD THEREOF
WAFER CLEANING DEVICE CAPABLE OF SIMULTANEOUSLY ELIMINATING ORGANIC CONTAMINANTS AND METAL CONTAMINANTS AND A METHOD THEREOF
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机译:可同时消除有机污染物和金属污染物的晶圆清洗装置及其方法
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摘要
PURPOSE: A wafer cleaning device and a method thereof are provided to eliminate an SC(Standard Cleaning)-2 process and a rinse process, thereby simplifying processes. ;CONSTITUTION: A circulation unit circulates cleaning liquid in a cleaning bath. The cleaning bath includes an inner bath(121), a middle bath(122), and an outer bath. An ultrasound wave generating unit(140) increases wafer cleaning efficiency by vibrating cleaning liquid around a wafer. A cleaning liquid supply unit(130) comprises an ultra pure water supply line(131) and a chemical liquid supply line(132). A pump supplies power to cleaning liquid which circulates in circulation pipes.;COPYRIGHT KIPO 2011
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