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INNER SEMICONDUCTING LAYER MOLDING APPARATUS FOR THE EXTRA-HIGH VOLTAGE XLPE CABLE INTERMEDIATE CONNECTION BOX AND A INNER SEMICONDUCTIVE LAYER USING THE SAME
INNER SEMICONDUCTING LAYER MOLDING APPARATUS FOR THE EXTRA-HIGH VOLTAGE XLPE CABLE INTERMEDIATE CONNECTION BOX AND A INNER SEMICONDUCTIVE LAYER USING THE SAME
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机译:特高压XLPE电缆中间接线盒的内部半导电层模制装置和使用相同内部半导电层的模压装置
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摘要
PURPOSE: An inner semiconducting layer molding apparatus for an extra-high voltage XLPE cable intermediate connection box and an inner semiconducting layer using the same are provided to resolve inconvenience according to the advanced work using an arriving unit and an insulating tape by forming the inner semiconducting layer using a molding apparatus.;CONSTITUTION: A molding apparatus(10) is composed of a top mold(12) and a bottom mold(14). The top mold and bottom mold are combined through the connecting member(16) consisting of a bolt and a nut. An engaging lug(18) is respectively formed in the top mold and bottom mold. An injection nozzle(22) is formed in one side of the top mold in order to inject insulating compound. A pressure tube(26) is formed in the other side of the top mold in order to pressurize the insulating compound. An inner semiconducting layer is composed of the both sides interfacial section which overlaps with a cable semiconducting layer, a slope section, and the intermediate section which is formed between the both sides interfacial section and the slope section.;COPYRIGHT KIPO 2012
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