ELECTROLESS NICKEL PLATING SOLUTION, AN ELECTROLESS PLATING METHOD USING THE SAME, AND A NICKEL PLATING LAYER PREPARED BY THE SAME

摘要

PURPOSE: Electroless nickel plating solution, an electroless plating method using the same, and a nickel plating layer prepared by the same are provided to form a nickel plating layer without pits or crack using an electroless nick plating solution with improved stability.;CONSTITUTION: Electroless nickel plating solution comprises nickel sulfate as metal salt, sodium hypophosphite as reducing agent, and adipic acid, lactic acid, succinic acid, and citric acid as complexing agent. The plating solution of 1L includes adipic acid of 5~25g, lactic acid of 5~20g, succinic acid of 5~20g, and citric acid of 5~20g.;COPYRIGHT KIPO 2012