METHOD AND DEVICE FOR PLATING A COPPER LAYER ON WAFER CAPABLE OF PREVENTING DRAWBACKS IN THE COPPER LAYER WHEN THE COPPER LAYER IS PLATED ON THE WAFER

摘要

PURPOSE: Method and device for plating a copper layer on wafer are provided to prevent drawbacks in the copper layer when the copper layer is plated, since washing solution to wash the surface of wafer is provided.;CONSTITUTION: A device for plating a copper layer on wafer comprises a container(100), a ceiling unit, copper anode(130), a diaphragm unit(160), a rotating unit, an electrolyte supply pipe, a first drain port and a second drain port. The container holds electrolyte. The ceiling unit closes the container and holds wafer(200) to face electrolyte. The copper anode is installed to face the wafer. The diaphragm unit divides the internal space of the container into an upper space(120) and a lower space(110). The diaphragm unit opens the central part so that electrolyte from the container makes contact from the central part of the wafer.;COPYRIGHT KIPO 2012