Process for nickel plating copper-plated objects, e.g., circuit boards, comprises initially applying a copper layer to the object, activating the copper layer by applying a thin tin layer, and applying a nickel layer to the copper layer

摘要

Process for nickel plating copper-plated objects comprises initially applying a copper layer to the object, activating the copper layer by applying a thin tin layer, and applying a nickel layer to the copper layer.