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摘要

This invention relates to a BGA package including the heat sink and the heat dissipating rods method of the BGA package, Specifically, a method of dissipating the heat by installing a heat dissipating rods between the molding of a package top surface and to a heat sink rod is installed, the BGA package. Heat radiating method according to the invention is such that the heat dissipating rods made of at least one column type on a substrate of a BGA package, the heat dissipating rods the cross-sectional area in the lower part and the upper part of the column cross-sectional area than the portion corresponding to the middle part larger, and is characterized in that the thermal conductivity of the material of the heat dissipation rate of the heat rod is large than the other part of the BGA package, the heat generated in the substrate of the BGA package or ball that is discharged to the outside via the heat dissipating rods. Heat release method of the BGA package according to the present invention is to be able to efficiently release the heat generated within the package with a simple structure to the outside. In addition, it is possible to minimize the impact on the weight and size of the BGA package due to the simple structure, as well as to enable efficient heat dissipation by properly controlling the number of heat-dissipating rods, depending on the application of the BGA package.