HEAT DISSIPATION FIN, MANUFACTURING METHOD FOR HEAT DISSIPATION FIN, AND SEMICONDUCTOR PACKAGE PROVIDED WITH HEAT DISSIPATION FIN

摘要

The present invention provides: a heat dissipation fin which is formed of a sheet-making molded article containing a thermosetting resin, a fibrous filler made from at least one of carbon fiber and metal fiber, and a powdery filler made from a carbon material; and a manufacturing method for a heat dissipation fin, comprising a step for manufacturing, by using a sheet-making method, a sheet-making article from material slurry containing a thermosetting resin, a fibrous filler made from at least one of carbon fiber and metal fiber, and a powdery filler made from a carbon material, and a step for molding the sheet-making article by performing heating and pressurization thereon, to manufacture a heat dissipation fin formed of the sheet-making molded article.