The epoxy resin composition for printed wiring board , the resin composition varnish , prepreg , metal clad laminate , and multi-layer printed circuit board printed circuit board

摘要

(A) contains an epoxy resin (A-1) having a nitrogen atom and a bromine atom in the same molecule the epoxy resin component , (B) a phenolic resin (B-1) with the phenolic curing agent component , and (C) characterized in that the already containing a curing accelerator component containing an imidazole silane compound (C-1) containing a The epoxy resin composition for printed wiring board .