printed circuit board for an epoxy resin composition, printed wiring using the printed wiring board for an epoxy resin composition plate for prepreg and the printed wiring board for metal-clad laminate

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition which has high heat resistance while maintaining flame retardance, and also has excellent dielectric characteristics.;SOLUTION: An epoxy resin composition contains: (A) an epoxy compound whose number-average molecular weight is ≤1,000, and which has at least two epoxy groups in a molecule but does not contain any halogen atom; (B) a polyphenylene ether whose number-average molecular weight is ≤5,000; (C) a cyanate ester compound; (D) an organometallic sa (E) and a phosphorus-based flame retardant.;COPYRIGHT: (C)2014,JPO&INPIT