首页> 外国专利> EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG FOR PRINTED WIRING BOARD USING THE EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND METAL-CLAD LAMINATE FOR PRINTED WIRING BOARD

EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG FOR PRINTED WIRING BOARD USING THE EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND METAL-CLAD LAMINATE FOR PRINTED WIRING BOARD

机译:印刷线路板用环氧树脂组合物,印刷线路板用环氧树脂组合物预先配制的印刷线路板,印刷线路板用金属复合层板

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in dielectric characteristics, which can be equipped with high heat resistance while maintaining fire retardancy.SOLUTION: An epoxy resin composition is used which is characterized by containing (A) an epoxy compound having a number average molecular weight of 1000 or less, at least two epoxy groups in one molecule, and no halogen atom, (B) a polyphenylene ether having a number average molecular weight of 5000 or less, (C) a cyanate ester compound, (D) an organometallic salt, and (E) a phosphorus-based flame retardant.
机译:解决的问题:为了提供介电特性优异的环氧树脂组合物,其可以在维持阻燃性的同时具有高耐热性。解决方案:使用特征在于包含(A)具有以下特征的环氧化合物的环氧树脂组合物:数均分子量为1000以下,一个分子中至少有两个环氧基且无卤原子;(B)数均分子量为5000以下的聚苯醚;(C)氰酸酯化合物;(D )有机金属盐,以及(E)磷基阻燃剂。

著录项

  • 公开/公告号JP2015108154A

    专利类型

  • 公开/公告日2015-06-11

    原文格式PDF

  • 申请/专利权人 PANASONIC IP MANAGEMENT CORP;

    申请/专利号JP20150025949

  • 发明设计人 KITAI YUKI;FUJIWARA HIROAKI;IMAI MASAO;

    申请日2015-02-13

  • 分类号C08L63/00;C08G59/40;C08L71/12;C08L79/04;C08K5/098;C08K5/521;B32B15/092;B32B15/08;B32B27/18;H05K1/03;

  • 国家 JP

  • 入库时间 2022-08-21 15:35:16

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号