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it with tin whisker inhibitor and anti- tin whiskers taker 's method
it with tin whisker inhibitor and anti- tin whiskers taker 's method
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机译:它与锡晶须抑制剂和抗锡晶须服用者的方法
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摘要
The present invention is sufficient to smooth the surface of the material also be tin-plated with some etching amount of tin whiskers is of about the effective agent to be in tin whisker and whisker resistance tin plating method using the same water prevented. ; and tin whiskers agent of the present invention the pH is below 5, the iron-based oxidant compound preferably ferric chloride, ferric sulfate and / or ferric nitrate, preferably a nonionic surfactant represented by the following general formula (1) and / or the compound represented by the general formula (2) as, and copper containing ion :;A[(C3H6O)n(C2H4O)mH]k (1);A[(C2H4O)m(C3H6O)nH]k (2) in ; (the formula (1) and (2), wherein A is a k-valent active hydrogen-containing compound residue, wherein k is a number of 1 to 4, wherein n is from 3 to The number of 35, and the m is the number of 1 to 70).
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机译:本发明足以使材料表面光滑,也可以用一定量的锡晶须的蚀刻量镀锡,这大约是在锡晶须和用相同的水防止的耐晶须锡的镀锡方法中的有效剂。 ;和本发明的锡晶须剂的pH低于5,铁基氧化剂化合物优选氯化铁,硫酸铁和/或硝酸铁,优选由以下通式(1)表示的非离子表面活性剂和/或化合物通式(2)表示为,含铜离子:; A [(C 3 Sub> H 6 Sub> O) n Sub>(C < Sub> 2 Sub> H 4 Sub> O) m Sub> H] k Sub>(1); A [(C 2 Sub> H 4 Sub> O) m Sub>(C 3 Sub> H 6 Sub> O) n Sub> H] k Sub>(2)在; (式(1)和(2),其中A为k价含活性氢的化合物残基,其中k为1-4的数,其中n为3-35的数,且m为1到70之间的数字)。
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