Producing electrically conductive, structured or fully flat surface, comprises applying base layer on a support using a dispersion, curing and/or drying the material, exposing particle by partial disruption and forming metal- on base layer

摘要

Producing electrically conductive, structured or fully flat surfaces on a support, comprises: (a) applying a structured or fully flat base layer on the support using a dispersion, which contains electrically conductive particles of at least one first metal in a matrix material; (b) curing and/or drying the matrix material; (c) exposing the electrically conductive particles by at least partial disruption of the cured and/or dried matrix; and (d) forming a metal layer on the structured or fully flat base layer by electroless deposition of the second metal from a liquid phase. Producing electrically conductive, structured or fully flat surfaces on a support, comprises: (a) applying a structured or fully flat base layer on the support using a dispersion, which contains electrically conductive particles of at least one first metal in a matrix material; (b) at least partially curing and/or drying the matrix material; (c) at least partially exposing the electrically conductive particles by at least partial disruption of the cured and/or dried matrix; and (d) forming a metal layer on the structured or fully flat base layer by electroless deposition of at least one second metal from a liquid phase, that contains the corresponding ions of the second metal, where the liquid phase further contains an ionic liquid of anions and cations.