首页> 外国专利> Producing electronic assembly, comprises providing electrically conductive film including support film and electrical component with electrical contact point, and forming component with electrical contact point on conductive film

Producing electronic assembly, comprises providing electrically conductive film including support film and electrical component with electrical contact point, and forming component with electrical contact point on conductive film

机译:生产电子组件,包括提供包括支撑膜和具有电接触点的电气部件的导电膜,以及在导电膜上形成具有电接触点的部件

摘要

The method of producing an electronic assembly comprises providing an electrically conductive film including a support film and an electrical component (5) with an electrical contact point, forming the component with the electrical contact point on the electrically conductive film, providing a support (9) from a flexible material, laminating the film with the support that is arranged on the electrical component between the film and support, structuring the electrically conductive film of conductors (11) and then cooling their surfaces, and forming a mechanical and electrical connection. The method of producing an electronic assembly comprises providing an electrically conductive film including a support film and an electrical component (5) with an electrical contact point, forming the component with the electrical contact point on the electrically conductive film, providing a support (9) from a flexible material, laminating the film with the support that is arranged on the electrical component between the film and support, structuring the electrically conductive film of conductors (11) and then cooling their surfaces, and forming a mechanical and electrical connection between the electrical component and the electrically conductive film, winding the film with the support, wrapping the electrical component with a filler material (19) of a polymer, filling the filler material into a predetermined shape by casting, foaming, extrusion or lamination, generating an additional insulated and/or dielectric support layer on the produced conductors, providing reinforcement layers on the support layer or optionally separating the support subsequent to the structuring step, and cutting the support to a predetermined shape to form the electronic assembly, before and/or after the step of laminating with the support. The film is carried out by an individual tailored film section or a continuous film of a roll. An arrangement of the electrical component is automatically carried out by an assembly robot or hand such as templates or position markers in and/or on the film. The support is separated into individual tailored support sections or a continuous support from the roll. The step of laminating is carried out with the support by exerting a contact pressure on the film in a direction of the support with simultaneous exposure to heat. The electrically conductive film is structured directly with a laser, ultrasound or sintering or by generating a positive or negative mask and etching in vacuum or inert gas atmosphere. The polymer is made of a thermoplastic, thermoset or an elastomer. An independent claim is included for an intermediate product for producing an electronic assembly.
机译:该电子组件的制造方法包括:提供包括支撑膜和具有电接触点的电气部件(5)的导电膜,在导电膜上形成具有电接触点的部件,提供支撑体(9)。由柔性材料制成,将薄膜与支撑物层压在一起,该支撑物布置在薄膜和支撑物之间的电气组件上,构造导体(11)的导电薄膜,然后冷却其表面,并形成机械和电气连接。该电子组件的制造方法包括:提供包括支撑膜和具有电接触点的电气部件(5)的导电膜,在导电膜上形成具有电接触点的部件,提供支撑体(9)。由柔性材料制成,将薄膜与支撑物层压在一起,该支撑物布置在薄膜和支撑物之间的电气组件上,构造导体(11)的导电膜,然后冷却其表面,并在电气之间形成机械和电气连接部件和导电膜,将其与支撑物缠绕在一起,用聚合物的填充材料(19)包裹电气部件,通过浇铸,发泡,挤压或层压将填充材料填充为预定形状,从而产生额外的绝缘和/或制成的导体上的介电支撑层,提供增强层在与支撑体层压的步骤之前和/或之后,在结构化步骤之后将支撑体在支撑层上或任选分离支撑体,并将支撑体切割成预定形状以形成电子组件。膜通过单独的定制膜部分或连续的卷膜进行。电气组件的排列由组装机器人或手(例如模板或薄膜中和/或薄膜上的位置标记)自动完成。支撑物被分成单独的定制支撑部分或来自辊的连续支撑物。通过在同时暴露于热的同时在支撑体的方向上对膜施加接触压力来与支撑体一起进行层压步骤。可以直接通过激光,超声波或烧结或通过生成正或负掩模并在真空或惰性气体气氛中进行蚀刻来构造导电膜。该聚合物由热塑性,热固性或弹性体制成。包括用于生产电子组件的中间产品的独立权利要求。

著录项

  • 公开/公告号DE102010014579A1

    专利类型

  • 公开/公告日2011-10-13

    原文格式PDF

  • 申请/专利权人 WUERTH ELEKTRONIK ROT AM SEE GMBH & CO. KG;

    申请/专利号DE20101014579

  • 发明设计人 KOSTELNIK JAN DR.;

    申请日2010-04-09

  • 分类号H05K1/18;H05K1/03;B23K26/20;H05K7/20;

  • 国家 DE

  • 入库时间 2022-08-21 17:47:20

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号