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Measuring device for the automated testing of wafers

机译:晶圆自动测试的测量装置

摘要

Measuring device for the automated testing of wafers,characterized by the,that this comprises:a loading device, whereby, at a side of at least an area for the pretreatment, an area for the cleaning and extraction, an area for the rearwardly directed recording and separation and a region for the reaction and the receptacle of the wafers are formed, and these are used in order to carry out a filling and in this connection, the measurement object is being tested and in order to carry out the reaction,a mechanism which is connected with the charger, and this is used to the measurement operation the loading device of the shaking or vibrating, and there is a desired mixture from the retention of the object under measurement in the loading device as well as of the starting material and of the arranged wafers, a temperature control mechanism which is connected with the charger, and this is used for the measurement operation the temperature in the loading device to control,a region of the safe..
机译:一种用于晶片自动测试的测量装置,其特征在于,该测量装置包括:装载装置,其中,在至少用于预处理的区域的一侧,用于清洁和提取的区域,用于向后定向的记录的区域分离并形成反应区域和晶片的容器,并使用它们进行填充,并在此连接中,对测量对象进行测试并进行反应,与充电器相连的装置,用于振动或振动的加载设备的测量操作,并且由于被测物保留在加载设备中以及起始材料和在所布置的晶片中,有一个温度控制机构,该温度控制机构与充电器连接,并且该温度控制机构用于测量操作中装载装置中的温度,以控制保险箱的区域。 。

著录项

  • 公开/公告号DE202011050013U1

    专利类型

  • 公开/公告日2011-09-15

    原文格式PDF

  • 申请/专利权人 FOOYIN UNIVERSITY HOSPITAL;

    申请/专利号DE202011050013U1

  • 发明设计人

    申请日2011-04-29

  • 分类号G01N35/02;G01N1/28;

  • 国家 DE

  • 入库时间 2022-08-21 17:46:52

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