LAMINATED BODY FOR THERMALLY-CONDUCTIVE FLEXIBLE BOARD, AND THERMALLY-CONDUCTIVE POLYIMIDE FILM

摘要

PROBLEM TO BE SOLVED: To provide a laminated body for a thermally-conductive flexible substrate and a thermally-conductive polyimide film excellent in heat radiation characteristic, thermal resistance, and size stability and having excellent tear resistance even in a thin film.SOLUTION: The laminated body and the thermally-conductive polyimide film contain a polyimide resin of 30 mol.% or more of a structural unit represented by a general formula (1) in the thermally-conductive polyimide film in which a thermally-conductive filler is dispersed in the polyimide resin, wherein the content of the thermally-conductive filler is in a range from 25 to 55 wt.% with flexibility, alternatively, in the formula, Ar1 is an organic group of tetravalent having one or more aromatic rings, and R is a lower alkyl group, a lower alkoxy group, a phenyl group, a phenoxy group with 1-6C or halogen.