LEAD FRAME SUBSTRATE FOR LED LIGHT EMITTING ELEMENT, LED LIGHT EMITTING ELEMENT DEVICE, AND LEAD FRAME FOR THE LED LIGHT EMITTING ELEMENT

摘要

PROBLEM TO BE SOLVED: To enhance adherence between a lead frame and a resin molded body.;SOLUTION: A lead frame substrate 10 has a resin molded body 11 having a recessed part 12, and a pad part 13 and a lead part 14 which are exposed at a bottom part of the recessed part 12. The pad part 13 and the lead part 14 are provided at a lead frame 50 formed by etching a plate like conductive metal material so as to form a predetermined shape. The lead frame 50 has a larger dimension than a bottom surface opening 12b of the recessed part 12, and has irregularities 51 having heights of 20 to 30 m formed at a region S which contacts with the resin molded body 11 on the outer peripheral side of the bottom surface opening 12b of the recessed part 12.;COPYRIGHT: (C)2012,JPO&INPIT