首页> 外国专利> FLAKY SILVER POWDER, METHOD FOR PRODUCING THE SAME, AND CONDUCTIVE PASTE

FLAKY SILVER POWDER, METHOD FOR PRODUCING THE SAME, AND CONDUCTIVE PASTE

机译:片状银粉,其制备方法和导电性糊剂

摘要

PROBLEM TO BE SOLVED: To provide flaky silver powder which can form a conductive film having excellent conductivity, to provide a method for producing the flaky silver powder, and to provide conductive paste.;SOLUTION: The flaky silver powder satisfies the following formula (1): A×A×B50, wherein A denotes the average particle diameter (unit: μm) by a laser diffraction scattering type particle size distribution measurement method of the flaky silver powder, and B denotes the BET specific surface area (unit: m2/g) of the flaky silver powder. In the method for producing flaky silver powder, silver powder with the average particle diameter of 1-15 μm is extended with a solvent and balls that have a diameter of 0.1-3 mm, and is subjected to flaking treatment till the average particle diameter of the silver powder reaches the maximum or passes through the maximum value.;COPYRIGHT: (C)2012,JPO&INPIT
机译:要解决的问题:提供可以形成具有优异导电性的导电膜的片状银粉,提供一种制备该片状银粉的方法,并提供一种导电浆料。;解决方案:片状银粉满足下式(1 ):A×B> 50,其中A表示薄片状银粉的通过激光衍射散射型粒度分布测量方法的平均粒径(单位:μm),B表示BET比表面积(单位:片状银粉的m 2 / g)。在制备薄片状银粉的方法中,将平均粒径为1-15μm的银粉在溶剂和直径为0.1-3mm的球中进行膨胀,并进行剥落处理直至平均粒径。银粉的直径达到最大值或通过最大值。;版权所有:(C)2012,JPO&INPIT

著录项

  • 公开/公告号JP2012092442A

    专利类型

  • 公开/公告日2012-05-17

    原文格式PDF

  • 申请/专利权人 DOWA ELECTRONICS MATERIALS CO LTD;

    申请/专利号JP20110212033

  • 发明设计人 MOGI NORIO;INOUE MASARU;

    申请日2011-09-28

  • 分类号B22F1/00;B22F9/04;H01B5/00;H01B13/00;H01B1/00;H01B1/22;

  • 国家 JP

  • 入库时间 2022-08-21 17:43:46

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