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RESIST FILM FOR ELECTRON BEAM, SUBSTRATE TO BE PROCESSED HAVING ORGANIC CONDUCTIVE FILM STACKED THEREON, METHOD FOR MANUFACTURING THE SUBSTRATE TO BE PROCESSED AND METHOD FOR FORMING RESIST PATTERN
RESIST FILM FOR ELECTRON BEAM, SUBSTRATE TO BE PROCESSED HAVING ORGANIC CONDUCTIVE FILM STACKED THEREON, METHOD FOR MANUFACTURING THE SUBSTRATE TO BE PROCESSED AND METHOD FOR FORMING RESIST PATTERN
PROBLEM TO BE SOLVED: To provide a substrate to be processed, which can be efficiently diselectrified, and can stably form a resist pattern with a high precision thereon even when being irradiated with an electron beam having a high current density.SOLUTION: A substrate to be processed having a resist film for an electron beam and an organic conductive film stacked thereon has a conductive inorganic thin film formed on the substrate to be processed, as a surface layer, and at least the resist film for the electron beam and the organic conductive film stacked on the substrate in series. A face to be processed of the substrate to be processed has a region in which a part of the organic conductive film and the conductive inorganic thin film directly come into contact with each other.
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