首页> 外国专利> SUBSTRATE TO BE PROCESSED HAVING LAMINATED THEREON RESIST FILM FOR ELECTRON BEAM AND ORGANIC CONDUCTIVE FILM METHOD FOR MANUFACTURING THE SAME AND RESIST PATTERNING PROCESS

SUBSTRATE TO BE PROCESSED HAVING LAMINATED THEREON RESIST FILM FOR ELECTRON BEAM AND ORGANIC CONDUCTIVE FILM METHOD FOR MANUFACTURING THE SAME AND RESIST PATTERNING PROCESS

机译:具有被层压的用于电子束的抗蚀膜的基板以及用于制造相同和抗蚀的图案化工艺的有机导电膜的方法

摘要

An object of the present invention is to provide a processed substrate capable of efficiently carrying out a charge elimination and capable of forming a stable high-precision resist pattern even when electron beam irradiation with a high current density is performed.According to the present invention, there is provided a substrate to be processed on which a resist film for an electron beam and an organic conductive film are laminated, wherein at least a resist film for an electron beam and an organic conductive film are sequentially laminated on a working substrate having a conductive inorganic thin film as a surface layer, A resist film for an electron beam and a substrate to be processed on which an organic conductive film is laminated, characterized in that the surface to be processed of the substrate has an area in which the organic conductive film and the conductive inorganic thin film are in direct contact with each other.;
机译:本发明的目的是提供一种即使在进行具有高电流密度的电子束照射时也能够有效地进行电荷消除并且能够形成稳定的高精度抗蚀剂图案的处理后的基板。提供了一种待处理的基板,在该基板上层压了用于电子束的抗蚀剂膜和有机导电膜,其中至少将用于电子束的抗蚀剂膜和有机导电膜顺序地层压在具有导电性的工作基板上作为表面层的无机薄膜,用于电子束的抗蚀剂膜和在其上层压有有机导电膜的待处理基板,其特征在于,所述待处理基板的表面具有在其中有机导电膜的区域导电无机薄膜彼此直接接触。

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