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SUBSTRATE TO BE PROCESSED HAVING LAMINATED THEREON RESIST FILM FOR ELECTRON BEAM AND ORGANIC CONDUCTIVE FILM METHOD FOR MANUFACTURING THE SAME AND RESIST PATTERNING PROCESS
SUBSTRATE TO BE PROCESSED HAVING LAMINATED THEREON RESIST FILM FOR ELECTRON BEAM AND ORGANIC CONDUCTIVE FILM METHOD FOR MANUFACTURING THE SAME AND RESIST PATTERNING PROCESS
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机译:具有被层压的用于电子束的抗蚀膜的基板以及用于制造相同和抗蚀的图案化工艺的有机导电膜的方法
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摘要
An object of the present invention is to provide a processed substrate capable of efficiently carrying out a charge elimination and capable of forming a stable high-precision resist pattern even when electron beam irradiation with a high current density is performed.According to the present invention, there is provided a substrate to be processed on which a resist film for an electron beam and an organic conductive film are laminated, wherein at least a resist film for an electron beam and an organic conductive film are sequentially laminated on a working substrate having a conductive inorganic thin film as a surface layer, A resist film for an electron beam and a substrate to be processed on which an organic conductive film is laminated, characterized in that the surface to be processed of the substrate has an area in which the organic conductive film and the conductive inorganic thin film are in direct contact with each other.;
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