The non-defective chip classification method in wafer, chip quality determination method using the same, as well as chip classification program, chip quality judgment program, the production method of marking mechanism and semiconductor device

摘要

PROBLEM TO BE SOLVED: To sort a good quality chip with the consideration for concern for the degree of quality degradation in the result of wafer test of a wafer, where multiple chips are disposed into a matrix form in X-axis direction and Y-axis direction.;SOLUTION: On the basis of a wafer test (S1), a defect chip is sorted to the defect group so that neighboring defect chips belong to the same group (S2); when the number of the defect chips belonging to the defect group is the prescribed threshold of the number of the defect chips, the defect group is decided as being in a distribution of concentrated defects (S3); the peripheral region of the distribution of concentrated defects, including all defect chips belonging to the defect group and nondefective chips in the periphery is set in a specific range (S4), and nondefective chips in the peripheral range of the distribution of concentrated defects are decided as being chips to be evaluated. For every objective chip, the number of directions in which the defect chips, belonging to the distribution of concentrated defects are present, is counted in the 4 directions in X-axis direction and Y-axis direction; and according to the number of directions, the objective chip is sorted to a plurality of chip indexes (S5).;COPYRIGHT: (C)2009,JPO&INPIT