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CHIP QUALITY DETERMINING METHOD, CHIP QUALITY DETERMINING PROGRAM, MARKING MECHANISM USING THE PROGRAM, AND FAULT GENERATION ANALYZING METHOD OF WAFER
CHIP QUALITY DETERMINING METHOD, CHIP QUALITY DETERMINING PROGRAM, MARKING MECHANISM USING THE PROGRAM, AND FAULT GENERATION ANALYZING METHOD OF WAFER
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机译:晶片质量确定方法,晶片质量确定程序,使用该程序的标记机制以及晶片的故障产生分析方法
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摘要
PROBLEM TO BE SOLVED: To determine quality of chip, while the quality is guaranteed for a defective wafer including partial faults.;SOLUTION: The number of defective chips (refer to mark ×), among a plurality of chips within the setting range near the chip, is calculated, based on the result of wafer test result of the wafer 1, as a first index for all proper chips including the proper chips 4, 6, 7, 8, the number of defective chips as the preset first threshold is compared with the first index calculated in the first index calculating step; and when the first index is equal to or larger than the first threshold, a proper chip as the determination object is determined as being a defective chip.;COPYRIGHT: (C)2004,JPO
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