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CHIP QUALITY DETERMINING METHOD, CHIP QUALITY DETERMINING PROGRAM, MARKING MECHANISM USING THE PROGRAM, AND FAULT GENERATION ANALYZING METHOD OF WAFER

机译:晶片质量确定方法,晶片质量确定程序,使用该程序的标记机制以及晶片的故障产生分析方法

摘要

PROBLEM TO BE SOLVED: To determine quality of chip, while the quality is guaranteed for a defective wafer including partial faults.;SOLUTION: The number of defective chips (refer to mark ×), among a plurality of chips within the setting range near the chip, is calculated, based on the result of wafer test result of the wafer 1, as a first index for all proper chips including the proper chips 4, 6, 7, 8, the number of defective chips as the preset first threshold is compared with the first index calculated in the first index calculating step; and when the first index is equal to or larger than the first threshold, a proper chip as the determination object is determined as being a defective chip.;COPYRIGHT: (C)2004,JPO
机译:要解决的问题:确定芯片的质量,同时保证包括部分缺陷在内的有缺陷晶片的质量。解决方案:解决方案:在接近设置范围内的多个芯片中有缺陷的芯片数(请参阅标记×)。基于晶片1的晶片测试结果,计算芯片,作为包括适当芯片4、6、7、8的所有适当芯片的第一指标,作为预设的第一阈值的有缺陷芯片的数量为与在第一指标计算步骤中计算出的第一指标进行比较;当所述第一指标等于或大于所述第一阈值时,确定作为所述判断对象的芯片为次品。版权:(C)2004,日本特许厅

著录项

  • 公开/公告号JP2004047542A

    专利类型

  • 公开/公告日2004-02-12

    原文格式PDF

  • 申请/专利权人 RICOH CO LTD;

    申请/专利号JP20020199982

  • 申请日2002-07-09

  • 分类号H01L21/66;

  • 国家 JP

  • 入库时间 2022-08-21 23:32:54

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