Manner and the solution in order to obstruct the formation of the metal particulate defective material to on the substrate in after the plated process

摘要

Topic SolutionsManner and the solution in order to obstruct the formation of the metal particulate defective material to on the substrate in after the plated process are offered. Concretely, the oxidizer it is not included, at the same time in order for the solution to have approximately 7.5 - 12.0 pH, the solution which includes non-metallic pH conditioner at the concentration which is sufficient is offered. Depending upon when, the solution may include the chelating agent. In addition or the solution may include the complexing agent of the type where two to which through the functional group which differs respectively each one offers the single cup consent in order to join to the metal ion differs at least in substituting. In case of in each case, at least as for one side or the chelating agent of the complexing agent, the non amine functional group or the non imine functional group is included. One execution configuration of manner in order to treat the substrate, plating metal formation on the substrate, and after that, includes the fact that the substrate is disclosed to the solution which includes the aforementioned configuration. Choice figure Drawing 1