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METHODS AND SOLUTIONS FOR PREVENTING THE FORMATION OF METAL PARTICULATE DEFECT MATTER UPON A SUBSTRATE AFTER A PLATING PROCESS

机译:电镀后防止基体上金属微粒缺陷形成的方法和解决方案

摘要

metal particles on a substrate after a plating solution and a method is provided for preventing the formation of defective material. In particular, not including the oxidizing agent, the solution is to have a pH between about 7.5 and about 12.0, there is provided a solution containing a non-metal pH adjusting agent in sufficient concentration. In some cases, the solution may include a chelating agent (chelating agent). In addition, a single point of attachment for binding metal ions via respectively different functional groups may comprise at least two different types of complexing agents each offering. If any, at least one complexing agent or chelating agent includes a functional group via a non-immigrant or Min. Embodiment of a method for processing a substrate and the subsequent step is the above-described configuration (make-up) plating a metal layer on a substrate comprises the step of exposing the substrate to a solution containing
机译:提供了一种在电镀液之后的基板上的金属微粒和防止形成有缺陷的材料的方法。特别是,不包括氧化剂,该溶液的pH应在约7.5至约12.0之间,提供了一种溶液,该溶液含有足够浓度的非金属pH调节剂。在某些情况下,溶液可以包含螯合剂(螯合剂)。另外,用于分别经由不同的官能团结合金属离子的单连接点可以包括各自提供的至少两种不同类型的络合剂。如果有的话,至少一种络合剂或螯合剂通过非移民或Min。包括官能团。用于处理基板的方法的实施例和随后的步骤是上述构造(补充)在基板上镀金属层的步骤,包括将基板暴露于含有

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