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METHODS AND SOLUTIONS FOR PREVENTING THE FORMATION OF METAL PARTICULATE DEFECT MATTER UPON A SUBSTRATE AFTER A PLATING PROCESS
METHODS AND SOLUTIONS FOR PREVENTING THE FORMATION OF METAL PARTICULATE DEFECT MATTER UPON A SUBSTRATE AFTER A PLATING PROCESS
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机译:电镀后防止基体上金属微粒缺陷形成的方法和解决方案
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摘要
metal particles on a substrate after a plating solution and a method is provided for preventing the formation of defective material. In particular, not including the oxidizing agent, the solution is to have a pH between about 7.5 and about 12.0, there is provided a solution containing a non-metal pH adjusting agent in sufficient concentration. In some cases, the solution may include a chelating agent (chelating agent). In addition, a single point of attachment for binding metal ions via respectively different functional groups may comprise at least two different types of complexing agents each offering. If any, at least one complexing agent or chelating agent includes a functional group via a non-immigrant or Min. Embodiment of a method for processing a substrate and the subsequent step is the above-described configuration (make-up) plating a metal layer on a substrate comprises the step of exposing the substrate to a solution containing
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