首页> 外国专利> Semiconductor device design support apparatus, semiconductor device design support method, and semiconductor device design support program

Semiconductor device design support apparatus, semiconductor device design support method, and semiconductor device design support program

机译:半导体器件设计支持装置,半导体器件设计支持方法和半导体器件设计支持程序

摘要

The present invention provides a design support device for a semiconductor device, etc. which can significantly reduce processing steps required in constructing power source wiring patterns and can perform processing at a high speed using a small amount of resources by making conventional bump cells include global power source wiring of meshed configuration. The design support device includes a wiring block acquisition unit that acquires predetermined wiring blocks as data from a plurality of wiring blocks whose wiring pattern structures formed in the insides of the respective wiring blocks in the layer thickness direction thereof are different from each other, the plural wiring blocks being used to form power source wiring layers of a plurality of layers of the semiconductor device, and a power source wiring unit that forms predetermined power source wiring layers of a plurality of layers of the semiconductor device using data by combining wiring blocks acquired by the wiring block acquisition unit.
机译:本发明提供了一种用于半导体器件等的设计支持设备,其可以显着减少构造电源布线图案所需的处理步骤,并且可以通过使常规的凸点单元包括全局电源来使用少量资源以高速执行处理。网格配置的源布线。该设计支持装置包括布线块获取单元,该布线块获取单元从多个布线块中获取预定的布线块作为数据,该多个布线块的各个层的厚度方向上形成于各个布线块的内部的布线图案结构彼此不同。布线块,用于形成半导体器件的多层的电源布线层;以及电源布线单元,其通过组合使用以下方法获得的布线块来使用数据形成半导体器件的多层的预定电源布线层:接线盒获取单元。

著录项

  • 公开/公告号JP4983068B2

    专利类型

  • 公开/公告日2012-07-25

    原文格式PDF

  • 申请/专利权人 富士通株式会社;

    申请/专利号JP20060093348

  • 发明设计人 中川 幸一;

    申请日2006-03-30

  • 分类号G06F17/50;H01L21/82;

  • 国家 JP

  • 入库时间 2022-08-21 17:39:38

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